With a flexible chamber size, the Explorer can accommodate substrates as large as 8 inches. The sputtering configuration accommodates DC, Pulsed DC, and RF sputtering with co-sputtering capability. Optional proprietary PEM technology is available for closed loop control transition mode and high rate reactive sputtering of metal oxides and nitrides.
We offer multiple pumping options – diffusion, cryogenic and turbo – in rear or bottom placement providing a system that will meet your process requirements and provide the rapid pumpdown you demand for high productivity.