Integrity Thin Film Deposition Solution
High-Volume Production
The Integrity thin film deposition system is built for high-volume production. The thermal and e-beam evaporation system provides high deposition rate, PID control, and excellent film crystallography, and it is configured for demanding semiconductor, compound semiconductor, and optical applications.
Thermal Evaporation
Thermal evaporation deposits both metals and nonmetals. It is commonly used for applications involving electrical contacts, yet it can be used for complex applications such as co-deposition. Thermal evaporation can be utilized to deposit indium layers for wafer bonding as well as metallic contact layers for thin film devices such as OLEDs, solar cells, and thin-film transistors.
The Integrity is built for high-volume production with PID control, a high deposition rate, and excellent film crystallography.
E-beam Evaporation
E-beam (electron beam) evaporation is one of the most common types of physical vapor deposition (PVD). E-beam evaporation enables the evaporation of metal and dielectric materials with very high melting points, making it possible to deposit materials that standard resistive thermal evaporation cannot. This method also deposits at faster rates than both sputtering and resistive evaporation.
Ion Sources
Denton Vacuum’s Endeavor RF Ion Source is designed to use a single extraction grid and operate without a filament. The RF ion source does not require an auxiliary electron neutralizer.
Optical Monitoring System
Repeatable performance and enhanced deposition control. Denton Vacuum’s LambdaPro® OMS monitors the properties of an optical coating as it is being deposited, allowing you to terminate the deposition at the desired optical thickness.
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