Failure Analysis

Infinity Failure Analysis is for delayering integrated circuits (IC) both at the wafer level and the die level. The Infinity FA uses broad ion beam technology which offers fast large-area layer removal to specific metallization layers in a chip. A secondary ion mass spectrometer (SIMS) is used for ending the etching process at the exact layer of interest.

The Infinity FA System is a cost-effective solution for etching and profiling devices with high throughput, providing rapid results at a low cost of ownership. It delivers excellent delayering uniformity and minimal damage over large areas.