System configurations designed for a particular thin film deposition, etch, or delayering application
Posted on
While traditional Ion Beam Sputtering (IBS) systems provide good process control, there are drawbacks for certain applications. Denton’s patented Biased Target Sputtering (BTS) can overcome many of the well-known process issues of IBS. In BTS, the low-energy ions generated are below the sputter threshold, and a negative voltage is applied to the target to ensure… Read More
Posted on
In order to achieve the desired properties and meet performance requirements, substrates may need to be pre-cleaned prior to deposition. While there are several methods that can be used to carry out this process, each has its own benefits depending on your pre-cleaning goal and deposition process. For example, RF glow plates use lower energy… Read More
Posted on
Welcome to the Denton Vacuum Applications Laboratory Denton Vacuum has hit a milestone with the Customer Application Development Center, the Apps Lab, as we pass the 10-year mark. The CADC empowers innovation by producing state-of-the-art sputtered, etch, and evaporated thin films and evaluating machine performances with our cutting-edge tools. In the CADC, Denton has three… Read More
Posted on
Enable Uniform Removal of the Entire Layer Regardless of Chemical Composition The Infinity FA from Denton Vacuum is optimized for delayering applications. The Infinity FA can utilize multiple etch technologies for uniform removal of layers. This high-performance etch tool is designed for delayering finished or in-process integrated circuits for failure analysis or reverse engineering. Learn… Read More
Posted on
Tungsten coatings are commonly used in semiconductor applications and have the potential to be used in emerging solar energy applications. These thin films are commonly subject to high stress and low adhesion, but when manufacturers try and compensate for stress, it leads to increased resistivity. In order to achieve the best performance and repeatability for… Read More
Posted on
An inverted cylindrical cathode configuration, compared to a planar or confocal configuration, has a few notable benefits because of its highly unique design. Unlike most cathode arrangements, where the cathodes sputter down, up or across the chamber, an inverted cylindrical cathode sputters inward toward the center of the cylinder. This offers several advantages for precision… Read More
Posted on
When investing in thin film deposition equipment, you need to think beyond the short-term results you want to achieve and focus on long-term goals and improvements. Your vendor should have the same focus, as well as the engineering capability to deliver continuous improvement, so you gain reliability, functionality and added value in your system over… Read More
Posted on
Extreme ultraviolet (EUV) light requires a very complex process to produce, but this technology has major implications for lithography and nano-machining in semiconductor manufacturing. To ensure performance and precision during manufacturing, components of EUV systems must be produced with high-precision optics and coatings. What is Extreme Ultraviolet Light? Extreme UV light has wavelengths anywhere between… Read More
Posted on
Thin film thickness uniformity is one of the main components of yield. Parts coated with a film that is outside the limits will need to be either reworked or scrapped. However, it is important not to over-specify the uniformity. If your design demands +/-5% uniformity and you specify +/-2% because it is “better”, you will… Read More
Posted on
If you’re looking to improve productivity in your sputtering process, there are several front-end options available to use. When paired with a compatible standard sputter chamber, these front-end options can be used to increase throughput and production efficiency while providing consistent, repeatable results. Front-end Options Single Chamber, Single Wafer Loadport: This type of front-end option… Read More