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Many of today’s electronic devices are based not on silicon semiconductors – the mainstay of the computer industry for decades – but on III-V semiconductors, built using specialized alloys with unique properties. However, the inherent cost, brittle nature, and unique characteristics of III-V semiconductors often demand special material handling during the manufacturing process. Denton offers… Read More
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While traditional Ion Beam Sputtering (IBS) systems provide good process control, there are drawbacks for certain applications. Denton’s patented Biased Target Sputtering (BTS) can overcome many of the well-known process issues of IBS. In BTS, the low-energy ions generated are below the sputter threshold, and a negative voltage is applied to the target to ensure… Read More
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Inspired by his work at the Frankford Arsenal in Philadelphia during World War II, Peter Denton established Denton Vacuum with the purpose of being an innovator in thin film deposition technology. Today, Denton is proud to offer state of the art deposition and etch solutions that utilize our proprietary technology. In this video, see the… Read More
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For over half a decade, Denton Vacuum has developed deposition and etch technology that enable users to enhance and innovate their research techniques and manufacturing processes. Discovering ground-breaking technology is not always a straightforward path. It takes a willingness to try, fail, and try again. At Denton, we take pride in our willingness to fail… Read More
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Denton’s Phoenix system platform is designed for high-volume in-line production. The system comes in two primary configurations: the Phoenix LC for magnetron sputtering with a rectangular or rotary linear cathode, and the Phoenix PIB-CVD for room-temperature chemical vapor deposition. Both systems can be configured with multiple sources to support a variety of applications. In this… Read More
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In order to achieve the desired properties and meet performance requirements, substrates may need to be pre-cleaned prior to deposition. While there are several methods that can be used to carry out this process, each has its own benefits depending on your pre-cleaning goal and deposition process. For example, RF glow plates use lower energy… Read More
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Thin films obtained by standard chemical vapor deposition (CVD) typically require temperatures ranging from 600°C to 800°C. Using plasma enhanced CVD (PE-CVD) allows reactions to occur at temperatures down to 350°C. Plasma ion beam CVD (PIB-CVD) advances this process even further by allowing room temperature deposition. Without the need to heat a substrate to such… Read More
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Conventional failure analysis methods have failed to scale with modern semiconductors, which are larger, more complex, and incorporate a wider variety of materials than ever before. Ion Beam Etch, or IBE, overcomes the challenges that conventional failure analysis methods cannot. IBE provides a uniform etch no matter the material, exposes large areas of interest with… Read More
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Magnetron sputtering is a plasma-based technique for physical vapor deposition (or PVD) coating that creates dense films with good adhesion. It is excellent for depositing materials with high melting points that cannot be evaporated, and it has the highest scalability of any PVD type. Magnetron sputtering provides excellent precision in film thickness and density of… Read More
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Traditional ion beam sputtering (IBS) provides excellent control over ion energies and thin film stoichiometry, making it the process of choice for sputtering metals and dielectrics for applications such as vanadium oxide microbolometers and VCSELs. Still, IBS has various challenges in meeting the necessary standards for applications in which a high degree of precision and… Read More